Black Technomelt Pellets

TECHNOMELT PA 658 is designed for encapsulation and sealing of printed circuit boards, batteries and connectors, and provides effective strain relief for wire harnesses and cables.
Due to its low viscosity, this material can be processed at low injection pressure - allowing encapsulation of fragile components without damage.
Click here:View PDF for material data sheet.

TECHNOBLK-500CC
Black Technomelt Pellets (500 cc bottle)
$10



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